Senior 3D Packaging Modeling Engineer

GlobalFoundries; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries in Malta, NY seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory tech. This role focuses on using commercial modeling tools to guide device integration and 3DHI optimizations for mechanical, thermal or electrical performance.

You will collaborate with cross-functional teams to drive 3DHI technology decisions and ensure robust packaging solutions in a fast-paced semiconductor

Qualifications

• MS degree with 5+ years of relevant experience
• PhD with 3+ years of relevant experience
• Experience using semiconductor mechanical/thermal/electrical simulation tools (e.g., Ansys Mechanical Workbench)
• Overall GPA 3.0 or higher; good academic standing
• Fluent English (written & verbal)
• Solid understanding of semiconductor processes and integration techniques
• Strong computer/software skills and ability to present results

Responsibilities

• Familiarity with commercial software for mechanical/thermal/electrical modeling
• Stress simulations for active areas and their impact on device performance
• Anticipate integration/process issues from information from teams
• Facilitate discussions to identify simulations that highlight critical process interactions
• Apply commercial simulation software to mimic semiconductor process flows
• Interact with integration, device, and design engineers to ensure working technology

Skills

Strong communication skills

Presentation skills

Collaboration with cross-functional团队

Education

MS degree

PhD

Tools

Ansys Mechanical Workbench

Other semiconductor modeling tools

LVS and DRC verification tools

Job description

GlobalFoundries in Malta, NY seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory tech. This role focuses on using commercial modeling tools to guide device integration and 3DHI optimizations for mechanical, thermal or electrical performance.

You will collaborate with cross-functional teams to drive 3DHI technology decisions and ensure robust packaging solutions in a fast-paced semiconductor