3D-HI Process Engineer for Advanced Packaging R&D

GLOBALFOUNDRIES U.S. INC.; Town of Malta (NY); Vor Ort; USD 98.000 - 176.000; Vollzeit

Zusammenfassung

GLOBALFOUNDRIES U.S. INC. is seeking an experienced R&D engineer to lead Advanced Packaging Lab 3D-HI initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.

The role involves driving process development across multiple programs, partnering with process, manufacturing, and vendor teams, and mentoring newer engineers while delivering IP on wafer integration and packaging technologies.

Qualifikationen

• Master’s in Electrical Engineering or related field from an accredited program.
• MS degree with 5-6 years of related work experience.
• In-depth knowledge of BEOL processes and integration (advanced bonding, TSVs).
• Strong problem solving and technical troubleshooting skills including DOE.
• English language proficiency (written & verbal).
• Up to 20% travel.

Aufgaben

• Drive 3D-HI process development for building blocks for advanced packaging.
• Partner with unit process engineers, manufacturing engineers, and vendors.
• Collaborate on joint development projects for 2.5D/3D-HI processes.
• Drive end-to-end process integration and planning for prototyping.
• Develop expertise in processes, materials, and tooling; optimize characterization.

Kenntnisse

3D-HI integration

BEOL processes

design of experiment

troubleshooting

English fluency

Ausbildung

Master’s in Electrical Engineering

MS degree with 5-6 years experience

PhD education preferred

Jobbeschreibung

GLOBALFOUNDRIES U.S. INC. is seeking an experienced R&D engineer to lead Advanced Packaging Lab 3D-HI initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.

The role involves driving process development across multiple programs, partnering with process, manufacturing, and vendor teams, and mentoring newer engineers while delivering IP on wafer integration and packaging technologies.