3D IC Packaging Intern: Hybrid Bonding & TSV Focus

GlobalFoundries; Town of Malta (NY); Vor Ort; USD 28.000 - 55.000; Vollzeit

Zusammenfassung

GlobalFoundries is seeking a 3D Heterogeneous Integration Development Intern to contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding and interposers. You will work with engineering teams to conduct experiments, analyze data, model processes, and support daily integration and process-development activities.

As an intern you will experience one-on-one mentorship, project-based assignments, and opportunities to network with executives while

Qualifikationen

• Sophomore or higher pursuing a relevant engineering degree during the internship.
• Minimum 3.0 GPA and in good academic standing.
• English fluency written & verbal.
• Travel up to 10%.
• Able to work at least 40 hours per week during internship.

Aufgaben

• Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
• Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.
• Develop or support process models to improve understanding of advanced packaging and integration performance.
• Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities.
• Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives.
• Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders.

Kenntnisse

Design of experiments

Data analysis

Process modeling

Documentation

Collaboration

Communication

Ausbildung

Bachelor's or Master's in Electrical Engineering

Bachelor's or Master's in Mechanical Engineering

Bachelor's or Master's in Chemical Engineering

Materials Science

Pursuing PhD in Engineering

Tools

DOE tooling

Jobbeschreibung

GlobalFoundries is seeking a 3D Heterogeneous Integration Development Intern to contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding and interposers. You will work with engineering teams to conduct experiments, analyze data, model processes, and support daily integration and process-development activities.

As an intern you will experience one-on-one mentorship, project-based assignments, and opportunities to network with executives while