Quantum Packaging Intern: Advanced Processing & Innovation

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 28,000 - 55,000; Full time

Benefits offered by this job

Mentorship program

Professional development opportunities

Executive networking

Job summary

GlobalFoundries is offering an internship in APL Quantum packaging development in the United States. The role involves executing experiments and supporting wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer work alongside engineering teams.

Interns will analyze experimental data, build process models, and contribute to daily integration and development activities. This six-month coop emphasizes mentorship, professional growth, and exposure to advanced semiconductor packaging

Qualifications

• Education – At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s in Engineering or related field.
• Must have at least an overall 3.0 GPA and be in good academic standing.
• Language Fluency - English (Written & Verbal)
• Travel - Up to 10%
• Ability to work at least 40 hours per week during the internship.

Responsibilities

• Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
• Analyze and interpret engineering data from experiments, process optimizations, and development activities.
• Develop or support process models to improve understanding of advanced packaging and integration performance.
• Assist engineers with daily integration, process-development, documentation, and problem-solving activities.
• Communicate experimental results, technical findings, and recommended next steps to project stakeholders.

Skills

English fluency

Design of experiments

Data analysis

Team collaboration

Education

Bachelor's or Master in Engineering or related field

Pursuing PhD in Engineering or related field

Tools

Semiconductor tooling

Job description

GlobalFoundries is offering an internship in APL Quantum packaging development in the United States. The role involves executing experiments and supporting wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer work alongside engineering teams.

Interns will analyze experimental data, build process models, and contribute to daily integration and development activities. This six-month coop emphasizes mentorship, professional growth, and exposure to advanced semiconductor packaging