3D IC Integration Engineer – Wafer & Die Level

Jobtailor; Essex Junction (VT); On-site; USD 70,000 - 110,000; Full time

Job summary

Jobtailor is seeking a technically versatile engineer to lead 3D heterogeneous integration process development with internal teams and external suppliers. You will help advance wafer-level and die-level integration, applying deep knowledge of packaging processes and materials to improve yields and reduce cycle times.

The role requires strong communication, leadership, and project management skills, plus a willingness to travel up to 10% and a PhD is preferred.

Qualifications

• Bachelor’s or Master’s in Electrical, Mechanical, Chemical Engineering, Materials Science or related field.
• Internship or co-op experience.
• Overall GPA of at least 3.0 and good academic standing.
• English fluency, written and verbal.
• Willingness to travel up to 10%.
• Fundamental knowledge of semiconductor packaging processes and integration.
• PhD education level preferred.
• Demonstrated leadership in workplace, school projects or competitions.
• Project management skills with ability to innovate and execute.
• Ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Responsibilities

• Drive 3D heterogeneous integration process development with engineers and suppliers.
• Collaborate with OSATs to develop wafer- and die-level 2.5D and 3D integration processes.
• Develop expertise in processes, materials and tooling using characterization resources.
• Drive failure mode analysis to improve yields and reduce cycle time and costs.
• Generate IP related to wafer integration and packaging technology.
• Collaborate with teams on assignments as needed.
• Perform activities safely and support EHSS requirements.
• Perform other duties as assigned by the manager.

Skills

Project management

Leadership

Communication

Planning

Navigate ambiguity

Education

Bachelor’s degree in EE/ME/CEM/Materials Science

Master’s degree in EE/ME/CEM/Materials Science

PhD preferred

GPA of at least 3.0

Job description

Jobtailor is seeking a technically versatile engineer to lead 3D heterogeneous integration process development with internal teams and external suppliers. You will help advance wafer-level and die-level integration, applying deep knowledge of packaging processes and materials to improve yields and reduce cycle times.

The role requires strong communication, leadership, and project management skills, plus a willingness to travel up to 10% and a PhD is preferred.