Senior 3D/Het Integration Process Engineer

Tokyo Electron US; City of Albany (NY); On-site; USD 124,000 - 175,000; Full time

Benefits offered by this job

Medical, Vision, and Dental Insurance

Paid Personal Leave

Holiday Time

401k Retirement Plans and Employer<br>

Tuition Reimbursement

Incentives for Healthy Lifestyles

Employee Assistance Programs

Job summary

TEL Technology Center, America (TTCA) seeks a Senior 3DI R&D Engineer to lead development of heterogeneous integration and 3D device technologies. You will steer projects from concept through process and hardware solutions, working with customers and TEL's global R&D network.

You will apply deep expertise in fusion/hybrid bonding, C2W and D2W integration, and wafer thinning to drive technology pathfinding. A PhD and strong publication record are highly valued.

Qualifications

• Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
• 5+ years of semiconductor R&D experience.
• Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
• Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
• Proven problem-solving, analytical, and experimental skills.
• Strong project management and organizational capabilities.
• Understanding of semiconductor technology roadmaps and industry trends.
• Excellent verbal and written communication skills.
• Strong record of technical innovation through publications, patents, or industry contributions.
• Demonstrated leadership in cross-functional technical programs.

Responsibilities

• Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
• Define technical strategy and align R&D activities with business objectives.
• Collaborate with global teams, customers, and joint development partners.
• Conduct fundamental research and develop innovative processes and hardware solutions.
• Evaluate technology feasibility through modeling, simulation, and experimentation.
• Drive technology pathfinding for heterogeneous and 3D device integration.
• Mentor researchers and foster technical excellence across the organization.
• Provide technical leadership for customer engagements and internal development programs.
• Communicate technical results and recommendations to key stakeholders.

Skills

Problem solving

Analytical thinking

Communication skills

Project management

Cross-functional leadership

Global environment adaptability

Education

Ph.D. in Materials Science or related field

Job description

TEL Technology Center, America (TTCA) seeks a Senior 3DI R&D Engineer to lead development of heterogeneous integration and 3D device technologies. You will steer projects from concept through process and hardware solutions, working with customers and TEL's global R&D network.

You will apply deep expertise in fusion/hybrid bonding, C2W and D2W integration, and wafer thinning to drive technology pathfinding. A PhD and strong publication record are highly valued.