Senior 3D Heterogeneous Integration Engineer

GlobalFoundries inc.; Town of Malta, Northern (NY, KY); Hybrid; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) to lead 3D-Heterogeneous Integration initiatives across multiple application domains. You will drive 3D-HI process development for multi-die stacking, die-to-wafer/wafer-to-wafer bonding, and collaborate with BEOL, TSVs, and OSAT partners to enable early prototyping.

Required qualifications include a Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science with 4–5 years of related

Qualifications

• Master’s degree in a relevant engineering field from an accredited program.
• MS degree with 4–5 years of related work experience.
• Strong knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Experience driving 3D-HI process development and end-to-end integration.

Responsibilities

• Drive 3D-HI process development for multi-die stacking, die-to-wafer and wafer-to-wafer bonding.
• Partner with unit process engineers, fabs, and vendors to enable new capabilities.
• Collaborate on joint development projects for 2.5D/3D HI processes.
• Lead end-to-end process integration and planning for prototyping across programs.
• Develop expertise in processes, materials, and tooling; optimize characterization resources.
• Diagnose failure modes and resolve integration challenges.
• Generate IP related to wafer integration and packaging technology.
• Mentor new hires and participate in hiring.

Skills

Design of experiments

Problem solving

Data analysis

Cross-functional collaboration

3D-HI knowledge

Education

Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science

Tools

OSAT collaboration

Wafer test/probe

Job description

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) to lead 3D-Heterogeneous Integration initiatives across multiple application domains. You will drive 3D-HI process development for multi-die stacking, die-to-wafer/wafer-to-wafer bonding, and collaborate with BEOL, TSVs, and OSAT partners to enable early prototyping.

Required qualifications include a Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science with 4–5 years of related