IC Packaging Design & Layout Engineer – 3D/SI Focus

inuplands; Cambridge (MA); On-site; USD 82,300 - 220,000; Full time

Job summary

Draper in Cambridge, MA, seeks an IC Packaging Design & Layout Engineer to lead end-to-end packaging for next-gen hardware. You will design substrates, interposers, and die-to-die routing using Siemens Xpedition, and collaborate with silicon, thermal/mechanical, and manufacturing teams to ensure manufacturability and reliability.

The role requires deep expertise in high-speed layout, SI/PI analysis, and design for manufacturability, with a focus on translating system requirements into robust

Qualifications

• Bachelor's degree in electrical engineering or related field.
• 5–10 years of experience in electrical engineering or related field.
• Deep knowledge of high-speed packaging and signal integrity.

Responsibilities

• Lead concept development for advanced IC packages and layouts.
• Produce detailed layout for substrates, interposers, and die-to-die routing.
• Collaborate with silicon, thermal/mechanical, and manufacturing teams.

Skills

Packaging layout

High-speed design

Signal integrity

Education

Bachelor's degree in electrical engineering

Tools

Siemens Xpedition

Ansys SIwave

HFSS

HyperLynx

Job description

Draper in Cambridge, MA, seeks an IC Packaging Design & Layout Engineer to lead end-to-end packaging for next-gen hardware. You will design substrates, interposers, and die-to-die routing using Siemens Xpedition, and collaborate with silicon, thermal/mechanical, and manufacturing teams to ensure manufacturability and reliability.

The role requires deep expertise in high-speed layout, SI/PI analysis, and design for manufacturability, with a focus on translating system requirements into robust