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GlobalFoundries is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration initiatives in the Advanced Packaging Lab. You will drive BEOL process development, bonding, TSVs, and die-to-wafer integration while partnering with process, manufacturing, and vendor teams to enable new capabilities and rapid prototyping across programs.
Ideal candidates have a Master’s in a relevant engineering field, 4–5 years of related experience, and strong DOE, analysis, and
GlobalFoundries is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration initiatives in the Advanced Packaging Lab. You will drive BEOL process development, bonding, TSVs, and die-to-wafer integration while partnering with process, manufacturing, and vendor teams to enable new capabilities and rapid prototyping across programs.
Ideal candidates have a Master’s in a relevant engineering field, 4–5 years of related experience, and strong DOE, analysis, and