Senior 3D Packaging & Thermal Modeling Engineer

Global Foundries; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory technologies. You will use commercial modeling tools to guide device integration and 3DHI optimizations for mechanical, thermal or electrical performance.

The role is based in our state-of-the-art 300mm Malta, New York fabrication facility, with emphasis on simulations to drive design decisions and enable robust device

Qualifications

• MS with a minimum of 5 years of relevant experience or PhD with a minimum of 3 years.
• Experience with semiconductor mechanical/thermal/electrical simulation tools, especially Ansys Mechanical Workbench.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• English language fluency (written & verbal).
• Solid understanding of semiconductor processes and integration techniques.

Responsibilities

• Familiarity with commercial software for mechanical or thermal or electrical modeling.
• Stress simulations for continuous and discontinuous active areas and how stress affects device performance.
• Anticipate integration/process issues based on information from teams and performed modeling.
• Facilitate discussion to identify simulations that highlight critical process interactions and drive 3DHI decisions.
• Apply commercial simulation software to mimic semiconductor process flows and highlight concerns.
• Collaborate with integration, device, and design engineers to ensure development of working technology.

Skills

Mechanical modeling

Thermal modeling

Electrical modeling

Ansys Mechanical Workbench

Stress analysis

Education

Master of Science

PhD

Tools

Ansys Mechanical Workbench

Cadence

Mentor Graphics

Keysight ADS

Job description

GlobalFoundries seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory technologies. You will use commercial modeling tools to guide device integration and 3DHI optimizations for mechanical, thermal or electrical performance.

The role is based in our state-of-the-art 300mm Malta, New York fabrication facility, with emphasis on simulations to drive design decisions and enable robust device