Entry-Level 3DIC Bonding & Packaging Engineer

GlobalFoundries inc.; New York, Northern (NY, KY); Hybrid; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join the Quantum Advanced Packaging team in New York. The role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding.

You will drive 3DHI process development with unit process engineers and suppliers, collaborate with OSATs on 2.5D/3D schemes, improve yields, reduce cycle time and cost, and generate IP for novel wafer integration.

Qualifications

• Experience coordinating cross-functional teams and projects.
• Strong analytical and problem-solving abilities.
• Excellent written and verbal communication in English.

Responsibilities

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop 2.5D and 3D heterogeneous integration processes.
• Develop expertise in materials, processes, and tooling; leverage characterization resources.
• Identify failure modes and drive mechanistic understanding to improve yields.
• Generate IP related to wafer integration and packaging technology.

Skills

Project management

Leadership

Technical communication

English proficiency

Education

Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related

Job description

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join the Quantum Advanced Packaging team in New York. The role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding.

You will drive 3DHI process development with unit process engineers and suppliers, collaborate with OSATs on 2.5D/3D schemes, improve yields, reduce cycle time and cost, and generate IP for novel wafer integration.