Lead 3D Heterogeneous Integration Engineer (3D-HI)

GlobalFoundries; New York (NY); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives across multiple application domains.

You will drive 3D-HI process development for building blocks such as multi-die stacking, die-to-wafer bonding, and 2.5D/3D integration, partnering with unit process engineers, manufacturing engineers, and vendors to enable new capabilities and early prototyping.

Qualifications

• Master’s in Electrical, Mechanical, Chemical, or Materials Science from an accredited program.
• MS with 4–5 years of related work experience.
• Deep knowledge of BEOL processes and integration (bonding, TSVs), bump/wafer finish, wafer test/probe, OSAT collaboration, package development & assembly.
• Strong problem solving and DOE experience.
• Minimum 3.0 GPA and good academic standing.
• Fluent in English (written and spoken).
• Travel up to 10%.

Responsibilities

• Drive 3D-HI process development for advanced packaging building blocks.
• Partner with unit process, manufacturing engineers, and vendors for GF fabs.
• Collaborate on joint development projects for 2.5D/3D HI processes.
• Lead end-to-end process integration and planning for new capabilities.
• Develop expertise in processes, materials, and tooling; optimize characterization resources.
• Drive data analysis, interpret results, and understand failure modes.
• Identify and resolve process integration issues and generate IP.

Skills

3D-HI processes

BEOL integration

Experiment design

Troubleshooting

English fluency

Education

Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, or Materials Science

Job description

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives across multiple application domains.

You will drive 3D-HI process development for building blocks such as multi-die stacking, die-to-wafer bonding, and 2.5D/3D integration, partnering with unit process engineers, manufacturing engineers, and vendors to enable new capabilities and early prototyping.