Senior TCB Process Engineer - Advanced Packaging Leader

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Singapore. You will work on customer packaging roadmaps, translate requirements into equipment specs, and support sales demos.

The role covers process development for TCB, 2.5D/3D packaging, and reliability evaluation. Applicants should have a minimum of 5 years in semiconductor advanced packaging and hands-on experience with TCB, NPI, and equipment qualification.

Qualifications

• Bachelor’s or Master’s degree in an engineering field relevant to advanced packaging.
• Minimum 5 years in semiconductor advanced packaging.
• Hands-on experience in TCB, advanced packaging, flip chip, and NPI.
• Experience with process and equipment qualification and manufacturing engineering.
• Familiarity with HBM/CoWoS/CoPoS/chiplets and 2.5D/3D packaging.
• Knowledge of AI accelerator packaging, HBM integration, or heterogeneous integration is a plus.

Responsibilities

• Understand customer roadmaps and translate into equipment specs.
• Participate in customer technical discussions and demonstrations.
• Develop and support applications involving TCB, flip chip, and related packaging.
• Evaluate process windows, yield, reliability, and warpage.
• Provide technical guidance in equipment development and qualification.
• Monitor industry trends and support technology roadmap planning.

Skills

Thermo Compression Bonding (TCB)

Advanced Packaging Process Development

Flip Chip Assembly

New Product Introduction (NPI)

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

Yield Improvement

Reliability Testing

Failure Analysis

Package Warpage

Thermal Management

Alignment Accuracy

Semiconductor Packaging

SPC

DOE

Education

Bachelor's/Master's in Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Tools

ASMPT

BESI

Toray

Panasonic

Kulicke & Soffa

Job description

The Supreme HR Advisory is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Singapore. You will work on customer packaging roadmaps, translate requirements into equipment specs, and support sales demos.

The role covers process development for TCB, 2.5D/3D packaging, and reliability evaluation. Applicants should have a minimum of 5 years in semiconductor advanced packaging and hands-on experience with TCB, NPI, and equipment qualification.