Senior Packaging Applications Engineer - TCB & 3D/2.5D

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) based in Admiralty, Singapore.

The role requires guiding customers, translating roadmaps into equipment specs, and driving process development across advanced packaging technologies. You will lead qualification activities, optimize bond processes, and collaborate with cross-functional teams to deliver reliable, high-yield packaging solutions including 2.5D/3D, CoWoS,

Qualifications

• Bachelor's or Master's Degree in one of the listed engineering disciplines.
• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in TCB, advanced packaging, Flip Chip, NPI, process qualification, equipment qualification.
• Experience with HBMs, CoWoS, CoPoS, chiplets, 2.5D/3D packaging.
• Strong understanding of bond processes, SPC, DOE, yield, reliability, warpage, and thermal management.

Responsibilities

• Translate customer roadmaps into equipment specifications.
• Participate in technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather feedback and recommend product enhancements.
• Develop and support applications for TCB, Flip Chip, Hybrid Bonding, and related packaging.
• Evaluate and optimize bond force, temperature profiles, and process windows.
• Define machine architecture and specifications with engineering teams.
• Lead machine qualification efforts: FAT/SAT and customer buyoff.

Skills

TCB

Advanced packaging

Process qualification

DOE

Yield improvement

Reliability testing

Failure analysis

Thermal management

Alignment accuracy

SPC

Chiplet integration

2.5D/3D packaging

Education

Semiconductor Engineering

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Related Engineering disciplines

Tools

TCB equipment

ASMPT

BESI

Toray

Panasonic

Kulicke & Soffa

Job description

The Supreme HR Advisory PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding - TCB) based in Admiralty, Singapore.

The role requires guiding customers, translating roadmaps into equipment specs, and driving process development across advanced packaging technologies. You will lead qualification activities, optimize bond processes, and collaborate with cross-functional teams to deliver reliable, high-yield packaging solutions including 2.5D/3D, CoWoS,