Senior Advanced Packaging Applications Engineer (TCB/3D)

THE SUPREME HR ADVISORY PTE. LTD.

Singapore

On-site

SGD 89,000 - 112,000

Full time

5 days ago
Be an early applicant
Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Admiralty, Singapore.

The role focuses on customer engineering, process development, and equipment qualification for advanced packaging technologies including TCB, flip chip, and 2.5D/3D concepts. You will work with multidisciplinary teams, evaluate process windows, and drive reliability, yield, and package warpage improvements while supporting product strategy and

Qualifications

  • - Experience in Thermo Compression Bonding (TCB) and advanced packaging processes.
  • - Knowledge of flip chip assembly, 2.5D/3D packaging, and HBM/CoWoS integration.
  • - Familiarity with DOE, SPC, and yield improvement techniques.
  • - Ability to define machine acceptance criteria and participate in FAT/SAT.

Responsibilities

  • Understand customer packaging roadmaps and manufacturing requirements.
  • Translate process requirements into equipment specifications.
  • Participate in customer technical discussions and application reviews.
  • Support technical sales activities and customer demonstrations.
  • Gather customer feedback and recommend future product enhancements.

Skills

TCB (Thermo Compression Bonding)
Advanced Packaging
Flip Chip Assembly
NPI
Process Qualification
Equipment Qualification
Manufacturing Engineering
Yield Improvement
Reliability Testing
Failure Analysis
Package Warpage
Thermal Management
Alignment Accuracy
Semiconductor Manufacturing

Education

Bachelor's or Master's Degree in Materials Engineering
Bachelor's or Master's Degree in Mechanical Engineering
Bachelor's or Master's Degree in Electrical Engineering
Bachelor's or Master's Degree in Chemical Engineering
Bachelor's or Master's Degree in Physics
Bachelor's or Master's Degree in Semiconductor Engineering
Related Engineering disciplines

Tools

ASMPT
BESI
Toray
Panasonic
Kulicke & Soffa

Job description

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Admiralty, Singapore.

The role focuses on customer engineering, process development, and equipment qualification for advanced packaging technologies including TCB, flip chip, and 2.5D/3D concepts. You will work with multidisciplinary teams, evaluate process windows, and drive reliability, yield, and package warpage improvements while supporting product strategy and

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Advanced Packaging Engineer: TCB & 3D IC Packaging
Senior Advanced Packaging Engineer: TCB & 3D IC Packaging

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Packaging Applications Engineer - TCB & 3D/2.5D
Senior Packaging Applications Engineer - TCB & 3D/2.5D

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer – TCB, 3D & HBM Expert
Senior Advanced Packaging Engineer – TCB, 3D & HBM Expert

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior TCB Packaging Applications Engineer
Senior TCB Packaging Applications Engineer

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior TCB Process Engineer - Advanced Packaging Leader
Senior TCB Process Engineer - Advanced Packaging Leader

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Packaging Applications Engineer - TCB & 3D Packaging
Senior Packaging Applications Engineer - TCB & 3D Packaging

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer – TCB & 3D/2.5D Expert
Senior Advanced Packaging Engineer – TCB & 3D/2.5D Expert

The Supreme HR Advisory Pte Ltd • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer - TCB & 3D Integration
Senior Advanced Packaging Engineer - TCB & 3D Integration

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer: TCB & 3D/Chiplet Expert
Senior Advanced Packaging Engineer: TCB & 3D/Chiplet Expert

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Advanced Packaging Engineer - TCB & 3D Packaging
Advanced Packaging Engineer - TCB & 3D Packaging

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000