Senior Advanced Packaging Engineer: TCB & 3D IC Packaging

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Singapore. The role focuses on customer applications, process development for TCB, 2.5D/3D packaging, and reliable equipment qualification.

You will work with multidisciplinary teams, optimize bond processes, analyze yield, and support technical demonstrations and customer interactions to drive product enhancements and roadmap planning.

Qualifications

• - Bachelor's or Master's degree in one of the listed engineering disciplines.
• - Minimum 5 years in semiconductor advanced packaging.
• - Hands-on experience in TCB, advanced packaging, Flip Chip, NPI, process and equipment qualification.
• - Experience with HBM/CoWoS/CoPoS/Chiplets/2.5D/3D packaging and large die packaging.
• - Knowledge of package warpage, thermal management, yield, reliability, DOE and SPC.

Responsibilities

• - Understand customer packaging roadmaps and requirements.
• - Translate process requirements into equipment specs and support customer discussions.
• - Develop and optimize packaging processes including TCB, HBMs, CoWoS/CoPoS and 2.5D/3D packaging.
• - Lead machine architecture discussions and define acceptance criteria.
• - Support FAT/SAT, qualification reporting and continuous improvement.

Skills

TCB (Thermo Compression Bonding)

Advanced packaging

Chiplet integration

HBM packaging

CoWoS/CoPoS

Package warpage

DOE

Yield improvement

Education

Bachelor's or Master's degree in Engineering (Materials/Mechanical/Electrical/Chemical)

Semiconductor Engineering (related)

Tools

TCB equipment

ASMPT / BESI / Toray / Panasonic / Kulicke & Soffa equipment

Job description

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Singapore. The role focuses on customer applications, process development for TCB, 2.5D/3D packaging, and reliable equipment qualification.

You will work with multidisciplinary teams, optimize bond processes, analyze yield, and support technical demonstrations and customer interactions to drive product enhancements and roadmap planning.