Senior Advanced Packaging Engineer: TCB & 3D/Chiplet Expert

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory provides a Senior Advanced Packaging Application Engineer (TCB) position based in Admirax St, Singapore. The role focuses on Thermo Compression Bonding, 2.5D/3D packaging, and Chiplet integration, with heavy customer interaction and process development responsibilities.

Ideal candidates bring 5+ years in semiconductor packaging, hands-on TCB experience, and strong collaboration skills to drive qualification, optimization, and yield improvement across packaging projects.

Qualifications

• Degree in engineering or physics with strong semiconductor packaging focus.
• Minimum 5 years in semiconductor advanced packaging.
• Hands-on experience in TCB, 2.5D/3D packaging, and chiplet integration.
• Experience with process/Equipment qualification and NPI support.
• Knowledge of wafer-to-package integration and reliability testing.

Responsibilities

• Understand customer roadmaps and translate requirements into equipment specs.
• Support customer discussions, demonstrations, and technical reviews.
• Develop and optimize packaging processes for TCB, 2.5D/3D, and CoWoS/CoPoS.
• Collaborate with cross-functional teams for equipment architecture and QC.
• Lead qualification, FAT/SAT support, and continuous improvement.

Skills

TCB (Thermo Compression Bonding)

Advanced Packaging

Flip Chip Assembly

NPI (New Product Introduction)

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

Bonding process optimization

Yield Improvement

Reliability Testing

Failure Analysis

Thermal Management

Education

Bachelor's or Master's Degree in Materials Engineering

Bachelor's or Master's Degree in Mechanical Engineering

Bachelor's or Master's Degree in Electrical Engineering

Bachelor's or Master's Degree in Chemical Engineering

Bachelor's or Master's Degree in Physics

Bachelor's or Master's Degree in Semiconductor Engineering

Related Engineering disciplines

Tools

ASMPt equipment

BESI equipment

Toray equipment

Panasonic equipment

Kulicke & Soffa equipment

AI accelerator packaging knowledge

Job description

The Supreme HR Advisory provides a Senior Advanced Packaging Application Engineer (TCB) position based in Admirax St, Singapore. The role focuses on Thermo Compression Bonding, 2.5D/3D packaging, and Chiplet integration, with heavy customer interaction and process development responsibilities.

Ideal candidates bring 5+ years in semiconductor packaging, hands-on TCB experience, and strong collaboration skills to drive qualification, optimization, and yield improvement across packaging projects.