Senior TCB Packaging Applications Engineer

THE SUPREME HR ADVISORY PTE. LTD.

Singapore

On-site

SGD 89,000 - 112,000

Full time

14 days+

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Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer specializing in Thermo Compression Bonding (TCB).

The role centers on customer application engineering, translating requirements into equipment specs, and supporting demonstrations and technical discussions. You will work on advanced packaging processes such as TCB, flip chip, 2.5D/3D packaging, CoWoS/CoPoS, and assist with process development, qualification, and reliability objectives.

Qualifications

Bachelor's or Master's in Engineering/Physics or related field.
Minimum 5 years in semiconductor advanced packaging.
Hands-on with TCB, advanced packaging, flip chip, and related processes.
Experience with NPI, process qualification, and equipment qualification.
Knowledge of HBM/CoWoS/Chiplets packaging advantageous.

Responsibilities

Understand customer packaging roadmaps and manufacturing requirements.
Translate process requirements into equipment specs and guidance.
Participate in customer technical discussions and demonstrations.
Support technical sales activities and customer demos.
Gather feedback and propose future product improvements.
Develop and support applications involving Thermo Compression Bonding, 2.5D/3D packaging, and related technologies.
Evaluate and optimize bond force, temperature profiles, process windows, and alignment accuracy.
Collaborate with multidisciplinary teams on machine architecture and specs.
Provide guidance through equipment development and qualification phases.
Act as internal customer during equipment development and FAT/SAT support.