Senior Packaging Applications Engineer - TCB & 3D Packaging

THE SUPREME HR ADVISORY PTE. LTD.

Singapore

On-site

SGD 89,000 - 112,000

Full time

6 days ago

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Job summary

The Supreme HR Advisory Pte. Ltd. in Singapore seeks a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) to lead customer engagements, translate roadmaps into equipment specs, and support demonstrations.

The role spans advanced packaging process development, including TCB, 2.5D/3D packaging, CoWoS and CoPoS, with a strong emphasis on yield and reliability. Candidates should hold a Bachelor’s or Master’s degree in engineering and have at least 5 years of

Qualifications

Minimum 5 years experience in semiconductor advanced packaging.
Hands-on experience with Thermo Compression Bonding (TCB) and related packaging processes.

Responsibilities

Understand customer packaging roadmaps and manufacturing requirements.
Translate process requirements into equipment specifications.
Participate in customer technical discussions and application reviews.
Support technical sales activities and customer demonstrations.
Gather customer feedback and recommend future product enhancements.
Develop and support applications involving TCB, 2.5D/3D packaging and related technologies.
Define machine architecture, functional specs and throughput targets with multidisciplinary teams.
Provide technical guidance throughout equipment development and qualification.