Senior Advanced Packaging Engineer – TCB & 3D/2.5D Expert

The Supreme HR Advisory Pte Ltd; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte Ltd is seeking a Senior Advanced Packaging Application Engineer / Process Engineer (Thermo Compression Bonding – TCB) to lead customer-facing applications in Admirax St. The role requires deep hands-on TCB and advanced packaging know-how, with a strong emphasis on reliability, yield, and process optimization.

You will collaborate with multidisciplinary teams, translate customer requirements into equipment specs, support demonstrations, and contribute to technology

Qualifications

• Bachelor's or Master's Degree in Materials Engineering, Mechanical, Electrical, Chemical, Physics, Semiconductor Engineering or related disciplines.
• Minimum 5 years of experience in semiconductor advanced packaging.
• Hands-on experience in Thermo Compression Bonding (TCB).
• Experience in Advanced Packaging Process Development and Flip Chip Assembly.
• Experience with NPI, Process Qualification and Equipment Qualification.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging, and related technologies.
• Define machine architecture, specifications, and acceptance criteria.
• Monitor industry developments and support technology roadmap planning.

Skills

TCB (Thermo Compression Bonding)

Advanced Packaging Process Development

Flip Chip Assembly

New Product Introduction (NPI)

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

HBM/CoWoS/CoPoS knowledge

Chiplets / 2.5D / 3D Packaging

Large Die Packaging

Reliability & Yield

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Tools

TCB Equipment (ASMPT)

TCB Equipment (BESI)

TCB Equipment (Toray)

TCB Equipment (Panasonic)

TCB Equipment (Kulicke & Soffa)

Job description

The Supreme HR Advisory Pte Ltd is seeking a Senior Advanced Packaging Application Engineer / Process Engineer (Thermo Compression Bonding – TCB) to lead customer-facing applications in Admirax St. The role requires deep hands-on TCB and advanced packaging know-how, with a strong emphasis on reliability, yield, and process optimization.

You will collaborate with multidisciplinary teams, translate customer requirements into equipment specs, support demonstrations, and contribute to technology