Senior Advanced Packaging Engineer – TCB, 3D & HBM Expert

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is recruiting a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) for Singapore Admiralty.

The role focuses on customer packaging roadmaps, translating requirements into equipment specs and supporting technical demonstrations. Strong experience in TCB, 2.5D/3D packaging, and NPI is essential. Applicants should have a minimum of five years in semiconductor packaging, with hands-on TCB and related technologies, and a background in

Qualifications

• - Bachelor's or Master's Degree in one of the listed engineering disciplines.
• - Minimum 5 years of experience in semiconductor advanced packaging.
• - Hands-on experience with TCB and related packaging technologies.
• - Knowledge of AI accelerator packaging or heterogeneous integration is a plus.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving Thermo Compression Bonding (TCB) and related packaging.
• Evaluate and optimize bond force, temperature profiles, process windows, and alignment.
• Work with multidisciplinary teams to define machine architecture and specifications.
• Provide guidance throughout equipment development and qualification.

Skills

Thermo Compression Bonding

Advanced Packaging

Flip Chip Assembly

New Product Introduction

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

HBM

CoWoS

CoPoS

Chiplets

2.5D Packaging

3D Packaging

Large Die Packaging

TCB Equipment Knowledge

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering Disciplines

Job description

The Supreme HR Advisory Pte. Ltd. is recruiting a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) for Singapore Admiralty.

The role focuses on customer packaging roadmaps, translating requirements into equipment specs and supporting technical demonstrations. Strong experience in TCB, 2.5D/3D packaging, and NPI is essential. Applicants should have a minimum of five years in semiconductor packaging, with hands-on TCB and related technologies, and a background in