Senior Advanced Packaging Engineer – TCB & 3D/HBM Specialist

The Supreme HR Advisory Pte Ltd; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte Ltd is seeking a Senior Advanced Packaging Application Engineer / Process Engineer (Thermo Compression Bonding – TCB) in Singapore. Location: Admirax St; 5-day workweek; 9:00am–6:00pm.

Salary SGD 8,000–SGD 10,000 per month based on experience and capability. Responsibilities include customer application engineering, packaging process development (TCB, 2.5D/3D, CoWoS/CoPoS), equipment development, and machine qualification.

Qualifications

• Bachelor's or Master's degree in engineering or physics.
• Minimum 5 years in semiconductor advanced packaging.
• Hands-on in TCB, advanced packaging process development, Flip Chip assembly.
• Experience with NPI, Process Qualification, Equipment Qualification.
• Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration is a plus.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and optimize TCB, 2.5D/3D packaging processes.
• Collaborate with multi-disciplinary teams on equipment development.
• Serve as the internal customer during equipment development.

Skills

Thermo Compression Bonding

Flip Chip Assembly

2.5D Packaging

3D Packaging

CoWoS

CoPoS

New Product Introduction

Process Qualification

Equipment Qualification

Manufacturing Engineering

DOE

SPC

Yield Improvement

Reliability Testing

Failure Analysis

Package Warpage

Thermal Management

Alignment Accuracy

Education

Bachelor's or Master's Degree in Materials/Mechanical/Electrical/Chemical Engineering or Physics

Job description

The Supreme HR Advisory Pte Ltd is seeking a Senior Advanced Packaging Application Engineer / Process Engineer (Thermo Compression Bonding – TCB) in Singapore. Location: Admirax St; 5-day workweek; 9:00am–6:00pm.

Salary SGD 8,000–SGD 10,000 per month based on experience and capability. Responsibilities include customer application engineering, packaging process development (TCB, 2.5D/3D, CoWoS/CoPoS), equipment development, and machine qualification.