Senior Advanced Packaging Engineer - TCB & 3D Integration

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking an Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding) to drive customer engagements and packaging development.

The role covers thermo-compression bonding, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration at Admirax St in Singapore. Ideal candidates have 5+ years in advanced packaging, hands-on TCB and NPI experience, and strong skills in yield improvement, process qualification, and equipment qualification.

Qualifications

• Minimum 5 years in semiconductor advanced packaging.
• Bachelor's or Master's in a relevant engineering field.
• Hands-on experience in TCB, NPI, process and equipment qualification.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging.
• Evaluate bond force, temperature profiles, process windows and alignment.
• Collaborate with cross-functional teams on machine architecture and ROI.

Skills

TCB

Advanced packaging

Flip Chip

NPI

Process Qualification

Equipment Qualification

Manufacturing Eng

Customer Process Dev

Yield Improvement

Reliability Testing

Failure Analysis

Education

Bachelor's or Master's in Materials Engineering

Mechanical/Electrical/Physics/semiconductor engineering

Tools

TCB equipment knowledge

ASMPT knowledge

BESI/Toray/Panasonic tooling

Job description

THE SUPREME HR ADVISORY PTE. LTD. is seeking an Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding) to drive customer engagements and packaging development.

The role covers thermo-compression bonding, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration at Admirax St in Singapore. Ideal candidates have 5+ years in advanced packaging, hands-on TCB and NPI experience, and strong skills in yield improvement, process qualification, and equipment qualification.