Senior Packaging Engineer - HBM/CoWoS, 2.5D/3D

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. seeks a Senior Advanced Packaging Application Engineer (TCB) to drive thermo- compression bonding and advanced packaging applications.

The role emphasizes process development for 2.5D/3D packaging, HBM, CoWoS, and chiplet integration within a fast-paced semiconductor setting. You will interact with customers to translate requirements into equipment specs, support technical demonstrations, and lead qualification activities across multi-disciplinary teams in

Qualifications

• - Bachelor’s or Master’s degree in a technical field related to advanced packaging.
• - 5+ years of experience in semiconductor advanced packaging.
• - Hands-on experience with TCB or related packaging processes.
• - Experience with NPI, Process Qualification, and equipment qualification.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Monitor industry developments in advanced packaging technologies and market trends.

Skills

Thermo Compression Bonding

HBM packaging

CoWoS / 2.5D/3D packaging

Chiplet integration

Process development

Yield improvement

Reliability testing

Failure analysis

Alignment accuracy

Thermal management

Education

Bachelor's or Master's in Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Tools

ASMPT equipment

BESI equipment

Toray equipment

Panasonic equipment

Kulicke & Soffa equipment

Job description

THE SUPREME HR ADVISORY PTE. LTD. seeks a Senior Advanced Packaging Application Engineer (TCB) to drive thermo- compression bonding and advanced packaging applications.

The role emphasizes process development for 2.5D/3D packaging, HBM, CoWoS, and chiplet integration within a fast-paced semiconductor setting. You will interact with customers to translate requirements into equipment specs, support technical demonstrations, and lead qualification activities across multi-disciplinary teams in