Senior Advanced Packaging Engineer - TCB & 2.5D/3D

THE SUPREME HR ADVISORY PTE. LTD.

Singapore

On-site

SGD 89,000 - 112,000

Full time

6 days ago
Be an early applicant
Application generator

A complete application in a minute — tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is hiring a Senior Advanced Packaging Application Engineer focused on Thermo Compression Bonding (TCB) for cutting-edge 2.5D/3D packaging, CoWoS, and HBM applications.

You will work with cross-functional teams to translate customer requirements into robust packaging solutions and guide new equipment development. You will evaluate process windows, bonding performance, and reliability, while collaborating with customers and suppliers to deliver state-of-the-art

Qualifications

  • Bachelor's or Master's Degree in Materials Engineering, Mechanical, Electrical, Chemical, Physics, Semiconductor Engineering or related fields.
  • Minimum 5 years of experience in semiconductor advanced packaging.
  • Hands-on experience in TCB, Advanced Packaging Process Development, Flip Chip Assembly, NPI, Process Qualification, Equipment Qualification, Manufacturing Engineering, and Customer Process Development.
  • Experience with advanced packaging tech such as HBM, CoWoS, CoPoS, Chiplets, 2.5D/3D Packaging, Large Die Packaging.
  • Knowledge of TCB equipment from leading manufacturers is advantageous.

Responsibilities

  • Understand customer packaging roadmaps and manufacturing requirements.
  • Translate process requirements into equipment specifications.
  • Participate in customer technical discussions and application reviews.
  • Support technical sales activities and customer demonstrations.
  • Gather customer feedback and recommend future product enhancements.
  • Develop and support applications involving Thermo Compression Bonding, Flip Chip Assembly, Hybrid Bonding, HBM, CoWoS, CoPoS, 2.5D/3D Packaging, Chiplet Integration and Large Die Packaging.
  • Evaluate and optimize bond force, temperature profiles, process windows and alignment accuracy.
  • Provide technical guidance throughout equipment development and act as internal customer during equipment qualification.

Skills

TCB
Advanced Packaging
NPI
Process Qualification
Equipment Qualification
Manufacturing Engineering
Customer Process Development
Reliability Testing

Education

Bachelor's or Master's Degree in Materials/Mechanical/Electrical/Chemical Engineering, Physics or Semiconductor Engineering

Tools

ASMPT
BESI
Toray
Panasonic
Kulicke & Soffa

Job description

THE SUPREME HR ADVISORY PTE. LTD. is hiring a Senior Advanced Packaging Application Engineer focused on Thermo Compression Bonding (TCB) for cutting-edge 2.5D/3D packaging, CoWoS, and HBM applications.

You will work with cross-functional teams to translate customer requirements into robust packaging solutions and guide new equipment development. You will evaluate process windows, bonding performance, and reliability, while collaborating with customers and suppliers to deliver state-of-the-art

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Packaging Engineer - HBM/CoWoS, 2.5D/3D
Senior Packaging Engineer - HBM/CoWoS, 2.5D/3D

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Packaging Applications Engineer - TCB & 3D/2.5D
Senior Packaging Applications Engineer - TCB & 3D/2.5D

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior TCB Packaging Applications Engineer
Senior TCB Packaging Applications Engineer

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Applications Engineer (TCB/3D)
Senior Advanced Packaging Applications Engineer (TCB/3D)

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer – TCB & 3D/2.5D Expert
Senior Advanced Packaging Engineer – TCB & 3D/2.5D Expert

The Supreme HR Advisory Pte Ltd • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer: TCB & 3D IC Packaging
Senior Advanced Packaging Engineer: TCB & 3D IC Packaging

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Packaging Applications Engineer - TCB & 3D Packaging
Senior Packaging Applications Engineer - TCB & 3D Packaging

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer – TCB, 3D & HBM Expert
Senior Advanced Packaging Engineer – TCB, 3D & HBM Expert

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer - TCB & 3D Integration
Senior Advanced Packaging Engineer - TCB & 3D Integration

THE SUPREME HR ADVISORY PTE. LTD. • Singapore

On-site
SGD 89,000 - 112,000
Senior Advanced Packaging Engineer: TCB & 3D/2.5D Focus
Senior Advanced Packaging Engineer: TCB & 3D/2.5D Focus

the supreme hr advisory pte. ltd. • Shenton Way

On-site
SGD 89,000 - 112,000