Senior Advanced Packaging Engineer: TCB & 3D/2.5D Focus

the supreme hr advisory pte. ltd.; Shenton Way; On-site; SGD 89,000 - 112,000; Full time

Job summary

HBM is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) to join its team in Singapore. You will drive application engineering for TCB, Flip Chip, CoWoS, and 2.5D/3D packaging, align with customer roadmaps and support technical discussions.

The role requires 5+ years in semiconductor advanced packaging, hands-on experience with TCB, NPI, Process/Equipment qualification, and collaboration across engineering disciplines.

Qualifications

• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in TCB, Advanced Packaging Process Development, Flip Chip Assembly, NPI, Process Qualification, Equipment Qualification, Manufacturing Engineering, Customer Process Development.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving Thermo Compression Bonding (TCB), Flip Chip Assembly, Hybrid Bonding, HBM Packaging, CoWoS, CoPoS, 2.5D/3D Packaging, Chiplet Integration, Large Die Packaging.
• Evaluate and optimize bond force, temperature profiles, process windows, alignment accuracy, package warpage, yield, reliability.
• Work closely with multidisciplinary teams to define machine architecture, functional specifications, accuracy requirements, throughput targets, thermal performance, bonding process capability, reliability requirements, customer acceptance criteria.

Skills

TCB

Advanced Packaging

NPI

Process Qualification

Equipment Qualification

Manufacturing Engineering

DOE

Yield Improvement

Reliability Testing

Failure Analysis

Package Warpage

Thermal Management

Alignment Accuracy

Semiconductor Manufacturing

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Job description

HBM is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) to join its team in Singapore. You will drive application engineering for TCB, Flip Chip, CoWoS, and 2.5D/3D packaging, align with customer roadmaps and support technical discussions.

The role requires 5+ years in semiconductor advanced packaging, hands-on experience with TCB, NPI, Process/Equipment qualification, and collaboration across engineering disciplines.