Advanced Packaging Engineer - TCB & 3D Packaging
THE SUPREME HR ADVISORY PTE. LTD.
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Job summary
The Supreme HR Advisory Pte. Ltd. in Singapore seeks a Senior Advanced Packaging Application Engineer to lead thermo compression bonding initiatives in Woodlands/Sembawang.
You will translate customer roadmaps into equipment specifications and support technical sales through demonstrations. The role covers process development for TCB, Flip Chip, 2.5D/3D packaging, and power/thermal performance. You will collaborate with multidisciplinary teams, qualify machines, monitor yields, and contribute to
Qualifications
- Bachelor's or Master's in Engineering or related field.
- Minimum 5 years in semiconductor advanced packaging.
- Hands-on experience with TCB, NPI, process/qualification.
Responsibilities
- Understand customer packaging roadmaps and manufactur ing requirements.
- Translate process requirements into equipment specifications.
- Participate in customer technical discussions and application reviews.
- Support technical sales activities and customer demonstrations.
- Gather customer feedback and recommend future product enhancements.
- Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging and related architectures.
Skills
Education
Tools
Job description
The Supreme HR Advisory Pte. Ltd. in Singapore seeks a Senior Advanced Packaging Application Engineer to lead thermo compression bonding initiatives in Woodlands/Sembawang.
You will translate customer roadmaps into equipment specifications and support technical sales through demonstrations. The role covers process development for TCB, Flip Chip, 2.5D/3D packaging, and power/thermal performance. You will collaborate with multidisciplinary teams, qualify machines, monitor yields, and contribute to
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