Senior Packaging Architect: Lead Production-Ready SiP

Micron Technology, Inc.; Singapore; Sur place; SGD 120 000 - 160 000; Plein temps

Résumé du poste

Micron Technology, Inc. is seeking a senior packaging engineer to own the package architecture from feasibility through tape-out and production readiness.

You will lead cross-functional reviews, making trade-offs across product, silicon, technology, and assembly teams while guiding junior engineers through complex decisions. The role requires deep expertise in package design, manufacturability, and AI-enabled workflows as part of future roadmap development.

Qualifications

• Advanced degree in engineering or related field.
• 10+ years of experience in package architecture and silicon–package co-design.
• Experience with feasibility studies, stack-up, I/O and interconnect planning.

Responsabilités

• Own package architecture and execution from feasibility through tape-out.
• Lead cross-functional reviews and risk closure across multiple teams.
• Balance performance, manufacturability, cost, and schedule to deliver production-ready solutions.
• Advance design rules and AI-enabled tooling for future products.
• Represent packaging in silicon–package–board co-design discussions.

Connaissances

Package architecture

SiP co-design

Feasibility & tape-out

Cross-functional leadership

Cadence Allegro

AI tooling literacy

Formation

Master's degree in Electrical, Mechanical, Materials Engineering

Outils

Cadence Allegro Package Designer / SiP Layout

Description du poste

Micron Technology, Inc. is seeking a senior packaging engineer to own the package architecture from feasibility through tape-out and production readiness.

You will lead cross-functional reviews, making trade-offs across product, silicon, technology, and assembly teams while guiding junior engineers through complex decisions. The role requires deep expertise in package design, manufacturability, and AI-enabled workflows as part of future roadmap development.