Advanced Packaging Principal Engineer, AI-Enabled

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, a leader in memory and storage solutions, is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Technology Development (APTD) team in Singapore. You will develop and enable advanced package technology for post-fab wafer finish and assembly processes, collaborating across groups to meet performance, cost, and reliability goals.

You will apply data analysis, model processes, and drive yield improvements, while partnering with process and product

Qualifications

• PhD or Master/Bachelor with significant research or industry experience in electrical, materials, chemical engineering or physics.
• Experience with semiconductor process integration and ability to develop advanced packaging tech for post-fab processes.
• Strong data analytics, modeling, and dashboarding capabilities.

Responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
• Drive yield improvements and reduce costs through innovative integration flows.
• Establish defense coverage through process measurement, inspection and testing.

Skills

Python

R

SQL

Visual Basic

Data analytics

Education

PhD with ≥2 years / Master’s ≥5 years / Bachelor’s ≥7 years in EE/Materials/Chemical/Physics

Tools

E3

FDC

RMS

Job description

Micron Technology, a leader in memory and storage solutions, is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Technology Development (APTD) team in Singapore. You will develop and enable advanced package technology for post-fab wafer finish and assembly processes, collaborating across groups to meet performance, cost, and reliability goals.

You will apply data analysis, model processes, and drive yield improvements, while partnering with process and product