Principal Engineer, Advanced Packaging & AI

Micron; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. seeks a highly skilled engineer to advance assembly processes for wafer-level packaging, die stacking, and related advanced packaging workflows.

You will work with cross-functional teams—Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality—to optimize performance, cost, reliability, and manufacturability while enabling smooth product transfers to production.

Qualifications

• PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Semiconductor process development or equipment evaluation experience preferred (wafer bonding, die stacking and packaging).

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies to meet performance and yield targets.
• Evaluate and promote new equipment and materials; set up process parameters for semiconductor tools.
• Ensure quality through defense coverage, data analysis, and advanced control opportunities.
• Collaborate across teams to transfer new products into high-volume manufacturing and document POR/MOR.

Job description

Micron Technology, Inc. seeks a highly skilled engineer to advance assembly processes for wafer-level packaging, die stacking, and related advanced packaging workflows.

You will work with cross-functional teams—Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality—to optimize performance, cost, reliability, and manufacturability while enabling smooth product transfers to production.