Senior Packaging Engineer: Lead SiP & Board Co-Design

Micron; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an experienced packaging engineer to own architecture from feasibility to production. You will lead cross-functional reviews, balance trade-offs, and mentor engineers to deliver reliable, scalable solutions.

Strong Cadence and SiP layout skills are required, with AI-enabled tooling integrated into daily workflows. The role demands a Master’s degree in a relevant engineering field and 10+ years of experience in package design, with leadership

Qualifications

• Master's degree in Electrical, Mechanical or Materials Engineering.
• 10+ years of experience in package architecture and silicon-package co-design.
• Hands-on with package technologies, manufacturability, substrates and reliability.
• Ownership of complex package designs from feasibility to manufacturing handoff.
• Advanced proficiency with package-design tools and review workflows.
• Strong leadership and stakeholder communication across teams.
• Integrates AI-assisted tools to improve efficiency and quality.

Responsibilities

• Own package architecture from feasibility through tape-out and production readiness.
• Lead cross-functional reviews, trade-offs, and risk closure across product, silicon, assembly, supplier, and OSAT teams.
• Balance performance, reliability, manufacturability, cost, quality, and schedule; mentor engineers.
• Advance design rules, methodologies, automation, and tech roadmaps for future products.
• Represent packaging in silicon-board co-design, resolving cost and manufacturing trade-offs.
• Apply AI literacy to research, analysis, and problem solving within governance standards.

Skills

Package architecture

SiP layout & co-design

Tape-out & NPI

Cadence Allegro

Cross-functional leadership

AI literacy

Education

Master’s degree in Electrical/Mechanical/Materials Engineering

PhD candidates welcome

Tools

Cadence Allegro Package Designer / SiP Layout

Job description

Micron Technology, Inc. in Singapore seeks an experienced packaging engineer to own architecture from feasibility to production. You will lead cross-functional reviews, balance trade-offs, and mentor engineers to deliver reliable, scalable solutions.

Strong Cadence and SiP layout skills are required, with AI-enabled tooling integrated into daily workflows. The role demands a Master’s degree in a relevant engineering field and 10+ years of experience in package design, with leadership