Senior Advanced Packaging Integration Engineer

Micron; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Technology Development (APTD) team in Singapore.

You will develop and deploy advanced packaging technologies for post-fab wafer finish and assembly, enhancing yield and reliability while coordinating with process and product engineering to enable scale‑up. The role requires strong data analytics, Python/R/SQL skills, and experience in semiconductor integration.

Qualifications

• PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in a related field.
• Proficiency in Python, R, and SQL for statistical analysis, modeling, and data analytics.
• Experience in semiconductor process integration and developing advanced package technology for post-fab wafer finish and assembly processes.

Responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Collaborate with Process/Product Engineering teams to integrate manufacturing processes for optimal performance.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to high-volume manufacturing facilities.

Skills

Python

R

SQL

Visual Basic

Data analytics

Statistics

DOE

SPC

Dashboarding

Process integration

Education

PhD in Electrical Engineering / Materials Science / Chemical Engineering / Physics

Master’s degree with ≥5 years

Bachelor’s degree with ≥7 years

Tools

E3

FDC

RMS

Job description

Micron Technology, Inc. is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Technology Development (APTD) team in Singapore.

You will develop and deploy advanced packaging technologies for post-fab wafer finish and assembly, enhancing yield and reliability while coordinating with process and product engineering to enable scale‑up. The role requires strong data analytics, Python/R/SQL skills, and experience in semiconductor integration.