Senior Advanced Packaging & AI-Driven Integration Engineer

Micron Technology; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Advanced Packaging Integration Engineer to drive development and deployment of advanced packaging technologies for high-performance memory products.

You will work with cross-functional teams to optimize yield, quality, and manufacturability while enabling smooth transfers to high-volume production. The role emphasizes collaboration across PWF Engineering, Assembly, and Product Engineering, with a focus on AI-enabled insights and continuous

Qualifications

• B.S./M.S./Ph.D. (or equivalent) in Electrical/Mechanical/Chemical Engineering, Physics, Materials or related fields.
• 2+ years semiconductor process integration experience, with ability to develop and enable advanced package technology.

Responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
• Improve product quality, drive yield improvements, reduce costs, and enhance productivity.
• Coordinate with PWF, Assembly, FE Wafer Fab, Test and Product Eng to transfer to high-volume production.

Skills

Python

R

SQL

Visual Basic

Data analytics

AI literacy

Root-cause analysis

Problem solving

Education

Engineering: E/E, Mechanical, Chemical, Physics, Materials (or related)

Tools

E3

FDC

RMS

Job description

Micron Technology, Inc. in Singapore is seeking an Advanced Packaging Integration Engineer to drive development and deployment of advanced packaging technologies for high-performance memory products.

You will work with cross-functional teams to optimize yield, quality, and manufacturability while enabling smooth transfers to high-volume production. The role emphasizes collaboration across PWF Engineering, Assembly, and Product Engineering, with a focus on AI-enabled insights and continuous