Lead Package Silicon Node Development Engineer

Micron Technology, Inc; Singapore; On-site; SGD 150,000 - 230,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology Singapore is seeking a highly skilled MTS to lead chip-package interaction (CPI) technology strategy for next-generation memory products. You will coordinate across Fab Process Integration, Package Design, and Global Quality to drive technology readiness and risk mitigation while delivering impactful results.

This senior role requires AI proficiency and strong cross-functional collaboration to influence silicon-node transitions and package integration.

Qualifications

• AI proficiency with AI-based workflows is a must.
• Experience in cross-functional collaboration across Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality.

Responsibilities

• Define and drive CPI technology strategy and roadmaps for next-generation memory products.
• Collaborate with global engineering teams to ensure robust technology readiness and mitigate risk.
• Lead execution excellence across silicon, package, and system-level integration.

Skills

AI proficiency

Cross-functional leadership

Job description

Micron Technology Singapore is seeking a highly skilled MTS to lead chip-package interaction (CPI) technology strategy for next-generation memory products. You will coordinate across Fab Process Integration, Package Design, and Global Quality to drive technology readiness and risk mitigation while delivering impactful results.

This senior role requires AI proficiency and strong cross-functional collaboration to influence silicon-node transitions and package integration.