Senior Engineer, Die-Level Packaging & AI-Enabled Tech

micron; Singapore; Presencial; SGD 150 000 - 190 000; Tempo integral

Resumo da oferta

Micron Technology, Inc. seeks a skilled professional to advance assembly processes for high-performance packaging, including wafer-level packaging and die stacking.

You will coordinate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to ensure robust manufacturing transitions. You will apply AI-enabled tools for daily research, analysis, and problem-solving, driving quality improvements and cost efficiencies

Qualificações

• PhD or Master’s degree with relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Semiconductor process development or equipment evaluation experience in wafer bonding, die stacking and packaging.

Responsabilidades

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Establish and improve process management projects to deliver technology node requirements.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for a variety of semiconductor equipment.
• Evaluate, promote, and plan for new equipment and materials.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives.
• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control.
• Ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities.
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Conhecimentos

Python

SQL

R

Visual Basic for automation

Data analytics

DOE

Process modeling

Dashboarding

Formação académica

PhD

Master's degree

Bachelor's degree

Ferramentas

E3

FDC

RMS

Visual Basic for automation

Descrição da oferta de emprego

Micron Technology, Inc. seeks a skilled professional to advance assembly processes for high-performance packaging, including wafer-level packaging and die stacking.

You will coordinate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to ensure robust manufacturing transitions. You will apply AI-enabled tools for daily research, analysis, and problem-solving, driving quality improvements and cost efficiencies