Principal Engineer – Advanced Packaging & AI Innovation

Micron Technology

Singapore

On-site

SGD 150,000 - 200,000

Full time

4 days ago

Be an early applicant

Application generator

A complete application in a minute — tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Micron Technology is seeking a highly qualified professional to advance assembly processes for state‑of‑the‑art packaging, including wafer‑level packaging and die stacking, to drive performance, cost efficiency, manufacturability, and reliability. You will deploy tools and collaborate across Packaging, Assembly, Front End Wafer Fab, and Quality teams in a fast‑paced environment.

The role emphasizes AI literacy, data analytics, and cross‑functional coordination to deliver robust technology

Qualifications

PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.
Semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field

Responsibilities

Develop and optimize assembly processes for advanced packaging technologies, focusing on yield, cost, quality.
Evaluate new equipment and materials; set up process parameters.
Ensure defense coverage through process, measurement, inspection, and testing; analyze data.
Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams.
Integrate AI-enabled tools to improve efficiency, quality, or effectiveness.