Senior Advanced Packaging Applications Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory client in Singapore is seeking an experienced engineer to drive advanced packaging development and customer-facing technical support. The role requires deep expertise in thermo compression bonding, flip chip assembly, and 2.5D/3D packaging, with a strong emphasis on process qualification, yield, and reliability.

Based in Admiralty, you will collaborate with multidisciplinary teams to define machine architectures, set acceptance criteria, and guide equipment development.

Qualifications

• Bachelor's or Master's degree in Engineering or Physical sciences.
• Minimum 5 years in semiconductor advanced packaging.
• Hands-on experience in TCB, Advanced Packaging, Flip Chip, NPI or Qualification.
• Experience with HBMs, CoWoS, CoPoS, Chiplets, 2.5D/3D packaging.
• Experience with TCB equipment from leading suppliers is a plus.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Skills

Semiconductor packaging

TCB (Thermo Compression Bonding)

Advanced packaging

NPI

Process qualification

Yield improvement

Reliability testing

DOE

Education

Bachelor's or Master's degree in Engineering/Physics

Materials/Mechanical/Electrical/Chemical/Semiconductor Engineering

Tools

TCB equipment

HBM/CoWoS/CoPoS knowledge

Job description

The Supreme HR Advisory client in Singapore is seeking an experienced engineer to drive advanced packaging development and customer-facing technical support. The role requires deep expertise in thermo compression bonding, flip chip assembly, and 2.5D/3D packaging, with a strong emphasis on process qualification, yield, and reliability.

Based in Admiralty, you will collaborate with multidisciplinary teams to define machine architectures, set acceptance criteria, and guide equipment development.