Senior Advanced Packaging Solutions Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd in Singapore is seeking an experienced professional for Customer Application Engineering and Advanced Packaging Process Development.

You will work on Thermo Compression Bonding, Flip Chip Assembly, and 2.5D/3D packaging, guiding equipment architecture and process capability. Responsibilities include evaluating bond forces and temperature profiles, defining machine acceptance criteria, and supporting FAT/SAT during equipment development.

Qualifications

• Bachelor's or Master's degree in Materials/Mechanical/Electrical/Chemical Engineering, Physics or Semiconductor Engineering.
• Minimum 5 years of experience in semiconductor advanced packaging.
• Hands-on experience with TCB, advanced packaging development, flip chip assembly, NPI, process and equipment qualification.
• Experience with HBMs, CoWoS/CoPoS, chiplets, 2.5D/3D packaging and large die packaging.
• Knowledge of AI accelerator packaging, HBM integration, or heterogeneous integration is a plus.

Responsibilities

• Understand customer packaging roadmaps and translate requirements into equipment specs.
• Develop and optimize advanced packaging processes and qualification plans.
• Lead customer technical discussions and demonstrations; support field activities.

Skills

Semiconductor Packaging

Education

Bachelor's or Master's in Materials/Mechanical/Electrical/Chemical Engineering, Physics or related

Tools

Thermo Compression Bonding (TCB)

Advanced Packaging Process Development

Flip Chip Assembly

New Product Introduction (NPI)

Process Qualification

Equipment Qualification

Manufacturing Engineering

Customer Process Development

HBM

CoWoS

CoPoS

Chiplets

2.5D Packaging

3D Packaging

Large Die Packaging

Job description

The Supreme HR Advisory Pte. Ltd in Singapore is seeking an experienced professional for Customer Application Engineering and Advanced Packaging Process Development.

You will work on Thermo Compression Bonding, Flip Chip Assembly, and 2.5D/3D packaging, guiding equipment architecture and process capability. Responsibilities include evaluating bond forces and temperature profiles, defining machine acceptance criteria, and supporting FAT/SAT during equipment development.