Senior Packaging Applications Engineer - TCB
THE SUPREME HR ADVISORY PTE. LTD.
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Job summary
The Senior Advanced Packaging Application Engineer (TCB) in Woodlands/Sembawang, Singapore, will drive customer success through advanced packaging applications, focusing on Thermo Compression Bonding and related technologies. You will translate customer needs into equipment specs and support in-depth discussions with clients.
The role requires hands-on experience in TCB, flip chip, and 2.5D/3D packaging, with a strong track record in process qualification, equipment qualification, and
Qualifications
- Bachelor’s or Master’s degree in Materials Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics, Semiconductor Engineering or related disciplines
- Minimum 5 years experience in semiconductor advanced packaging
- Hands-on experience in Thermo Compression Bonding (TCB)
- Hands-on experience in Advanced Packaging Process Development
- Hands-on experience in Flip Chip Assembly
- Hands-on experience in New Product Introduction (NPI)
- Hands-on experience in Process Qualification and Equipment Qualification
- Experience in Manufacturing Engineering and Customer Process Development
- Experience with HBMs, CoWoS, CoPoS, Chiplets, 2.5D/3D Packaging, Large Die Packaging
- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration is highly regarded
Responsibilities
- Understand customer packaging roadmaps and manufacturing requirements.
- Translate process requirements into equipment specifications.
- Participate in customer technical discussions and application reviews.
- Support technical sales activities and customer demonstrations.
- Gather customer feedback and recommend future product enhancements.
- Develop and support applications involving Thermo Compression Bonding, Flip Chip Assembly, 2.5D/3D packaging, etc.
- Evaluate and optimize bond force, temperature profiles, process windows, alignment accuracy, packager warpage, yield, and reliability.
- Work with multidisciplinary teams to define machine architecture, specifications, and throughput targets.
- Provide technical guidance throughout equipment development.
- Serve as internal customer during equipment development.
- Monitor industry developments in advanced packaging and support roadmap planning.
Skills
Education
Tools
Job description
The Senior Advanced Packaging Application Engineer (TCB) in Woodlands/Sembawang, Singapore, will drive customer success through advanced packaging applications, focusing on Thermo Compression Bonding and related technologies. You will translate customer needs into equipment specs and support in-depth discussions with clients.
The role requires hands-on experience in TCB, flip chip, and 2.5D/3D packaging, with a strong track record in process qualification, equipment qualification, and
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