Senior Advanced Packaging Engineer: 2.5D/3D & HBM Expert

The Supreme HR Advisory Pte. Ltd.

Singapore

On-site

SGD 89,000 - 112,000

Full time

30 hours ago

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Job summary

The Supreme HR Advisory Pte. Ltd. is seeking a Senior Advanced Packaging Engineer to lead advanced packaging activities in Singapore.

You will work on Thermo Compression Bonding, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration, coordinating with customers and internal teams. Responsibilities include developing packaging processes, validating equipment, supporting customer discussions, and driving yield and reliability improvements.

Qualifications

Bachelor's or Master's degree in a relevant engineering discipline.
Minimum 5 years experience in semiconductor advanced packaging.
Hands-on with TCB, advanced packaging, flip chip, NPI, process/ equipment qualification.

Responsibilities

Understand customer packaging roadmaps and manufacturing requirements.
Translate process requirements into equipment specifications.
Participate in customer technical discussions and application reviews.
Support technical sales activities and customer demonstrations.
Gather customer feedback and recommend future product enhancements.
Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration.
Evaluate bond force, temperature profiles, process windows, alignment accuracy, and package warpage for yield and reliability.
Provide guidance throughout equipment development and act as internal customer for machine qualification.
Monitor industry developments in advanced packaging technologies and semiconductor trends.