R&D Engineer: Thermal Compression Bonding for 2.5D/3D Packaging

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 37,000 - 44,000; Full time

Benefits offered by this job

Competitive remuneration package

Comprehensive range of benefits

Job summary

PEOPLE PROFILERS PTE. LTD. seeks an engineer to lead TC bonding process development for next-gen packaging technologies. You will drive bonding recipe development, co-planarity control, and qualification from R&D to customer stages.

Responsibilities include tool development, warpage control, FA and reliability enhancements, and leading customer programs. Strong DoE and English documentation skills are essential.

Qualifications

• Bachelor’s degree or higher in engineering or science (e.g., Materials Science, Chemistry, Chem Eng, Electronics, Advanced Materials)
• 3+ years R&D or mass production in Thermal Compression Bonding, flip-chip, or micro-bump bonding
• Proven experience driving customer development programs (e.g., JDP, customer qualification)
• Understanding of advanced semiconductor packaging, thermal-mechanical bonding, and warpage control
• Strong DoE, FA, and data reporting skills
• Ability to prepare technical docs and deliver presentations in English

Responsibilities

• Lead development, evaluation, and optimization of TC bonding and chip attach processes/equipment.
• Establish bonding recipes; ensure co-planarity and alignment; drive TC tools from R&D to qualification.
• Develop TC bonding for CoWoS PKG and CPO products.
• Develop and qualify TC tools and hardware.
• Control warpage and co-planarity.
• Conduct Failure Analysis and reliability improvements.
• Support customer development and technology transfer.
• Lead assigned projects; improve yield and address FA findings

Skills

R&D / mass prod in TC Bonding

DoE

Failure Analysis

Technical data reporting

Presentation skills

Education

Bachelor’s degree or higher in engineering or science

Job description

PEOPLE PROFILERS PTE. LTD. seeks an engineer to lead TC bonding process development for next-gen packaging technologies. You will drive bonding recipe development, co-planarity control, and qualification from R&D to customer stages.

Responsibilities include tool development, warpage control, FA and reliability enhancements, and leading customer programs. Strong DoE and English documentation skills are essential.