Senior Advanced Packaging Application Engineer ( TCB - Thermo Compression Bonding / Flip Chip Assembly / Up to $10k ) - 8890

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) in Singapore. The role focuses on customer applications, process development for TCB, 2.5D/3D packaging, and reliable equipment qualification.

You will work with multidisciplinary teams, optimize bond processes, analyze yield, and support technical demonstrations and customer interactions to drive product enhancements and roadmap planning.

Qualifications

• - Bachelor's or Master's degree in one of the listed engineering disciplines.
• - Minimum 5 years in semiconductor advanced packaging.
• - Hands-on experience in TCB, advanced packaging, Flip Chip, NPI, process and equipment qualification.
• - Experience with HBM/CoWoS/CoPoS/Chiplets/2.5D/3D packaging and large die packaging.
• - Knowledge of package warpage, thermal management, yield, reliability, DOE and SPC.

Responsibilities

• - Understand customer packaging roadmaps and requirements.
• - Translate process requirements into equipment specs and support customer discussions.
• - Develop and optimize packaging processes including TCB, HBMs, CoWoS/CoPoS and 2.5D/3D packaging.
• - Lead machine architecture discussions and define acceptance criteria.
• - Support FAT/SAT, qualification reporting and continuous improvement.

Skills

TCB (Thermo Compression Bonding)

Advanced packaging

Chiplet integration

HBM packaging

CoWoS/CoPoS

Package warpage

DOE

Yield improvement

Education

Bachelor's or Master's degree in Engineering (Materials/Mechanical/Electrical/Chemical)

Semiconductor Engineering (related)

Tools

TCB equipment

ASMPT / BESI / Toray / Panasonic / Kulicke & Soffa equipment

Job description

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB)

• Location: Admirax St
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

- Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

- Minimum5 yearsexperience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.