R&D Engineer - Thermal-Compression Bonding & Packaging

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 140,000 - 190,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. seeks a senior engineer to lead advanced ThermalCompression bonding process development for CoWoS packaging and related technologies. You will drive tool/hardware development, ensure warpage control, and coordinate customer-driven qualification programs.

The role requires 3+ years in TCB/R&D or mass production, strong DoE/FA skills, and proven ability to transfer technology to customers and internal teams.

Qualifications

• Bachelor’s degree or higher in engineering or science.
• 3+ years R&D or mass production experience in ThermalCompression Bonding.
• Experience driving customer development programs and managing requirements.
• Understanding of advanced semiconductor packaging, warpage control.
• Strong DoE, FA, and data reporting skills.
• Ability to prepare technical documents and deliver presentations.
• Reading and writing technical documents fluently.

Responsibilities

• Lead advanced TC bonding process development for CoWoS PKG and CPO.
• Tool and hardware development / qualification.
• Warpage and co-planarity control.
• Failure analysis and reliability enhancement.
• Customer development and technology transfer.
• Lead assigned projects.
• Yield improvement and yield FA.

Skills

DoE

FA

Data reporting

Project leadership

Customer development

Education

Bachelor's degree in engineering/science

Tools

TC bonder tools

Job description

PEOPLE PROFILERS PTE. LTD. seeks a senior engineer to lead advanced ThermalCompression bonding process development for CoWoS packaging and related technologies. You will drive tool/hardware development, ensure warpage control, and coordinate customer-driven qualification programs.

The role requires 3+ years in TCB/R&D or mass production, strong DoE/FA skills, and proven ability to transfer technology to customers and internal teams.