R&D Engineer – C/A (Chip Attach) & TCB (Thermal Compression Bonding)

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 37,000 - 44,000; Full time

Benefits offered by this job

Competitive remuneration package

Comprehensive range of benefits

Job summary

PEOPLE PROFILERS PTE. LTD. seeks an engineer to lead TC bonding process development for next-gen packaging technologies. You will drive bonding recipe development, co-planarity control, and qualification from R&D to customer stages.

Responsibilities include tool development, warpage control, FA and reliability enhancements, and leading customer programs. Strong DoE and English documentation skills are essential.

Qualifications

• Bachelor’s degree or higher in engineering or science (e.g., Materials Science, Chemistry, Chem Eng, Electronics, Advanced Materials)
• 3+ years R&D or mass production in Thermal Compression Bonding, flip-chip, or micro-bump bonding
• Proven experience driving customer development programs (e.g., JDP, customer qualification)
• Understanding of advanced semiconductor packaging, thermal-mechanical bonding, and warpage control
• Strong DoE, FA, and data reporting skills
• Ability to prepare technical docs and deliver presentations in English

Responsibilities

• Lead development, evaluation, and optimization of TC bonding and chip attach processes/equipment.
• Establish bonding recipes; ensure co-planarity and alignment; drive TC tools from R&D to qualification.
• Develop TC bonding for CoWoS PKG and CPO products.
• Develop and qualify TC tools and hardware.
• Control warpage and co-planarity.
• Conduct Failure Analysis and reliability improvements.
• Support customer development and technology transfer.
• Lead assigned projects; improve yield and address FA findings

Skills

R&D / mass prod in TC Bonding

DoE

Failure Analysis

Technical data reporting

Presentation skills

Education

Bachelor’s degree or higher in engineering or science

Job description

• To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures).
• To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.
• Advanced TC Bonding Process development for CoWoS PKG product family and CPO
• Tool & Hardware Development / Qualification
• Warpage & Co-planarity Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield Failure Analysis (FA)

Required Experience and Qualifications:

• Bachelor’s degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes
• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
• Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Ability to prepare technical documents and deliver presentations to internal and external stakeholders
• Proficiency in reading and writing technical documents in English
• Salary up to $6000
• Location: Yishun
• Mon To Fri 8am -518pm

JOB ID: GTJK009

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

We regret that only shortlisted candidates will be notified