Semicon R&D Engineer (Thermal Compression Bonding)

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 140,000 - 190,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. seeks a senior engineer to lead advanced ThermalCompression bonding process development for CoWoS packaging and related technologies. You will drive tool/hardware development, ensure warpage control, and coordinate customer-driven qualification programs.

The role requires 3+ years in TCB/R&D or mass production, strong DoE/FA skills, and proven ability to transfer technology to customers and internal teams.

Qualifications

• Bachelor’s degree or higher in engineering or science.
• 3+ years R&D or mass production experience in ThermalCompression Bonding.
• Experience driving customer development programs and managing requirements.
• Understanding of advanced semiconductor packaging, warpage control.
• Strong DoE, FA, and data reporting skills.
• Ability to prepare technical documents and deliver presentations.
• Reading and writing technical documents fluently.

Responsibilities

• Lead advanced TC bonding process development for CoWoS PKG and CPO.
• Tool and hardware development / qualification.
• Warpage and co-planarity control.
• Failure analysis and reliability enhancement.
• Customer development and technology transfer.
• Lead assigned projects.
• Yield improvement and yield FA.

Skills

DoE

FA

Data reporting

Project leadership

Customer development

Education

Bachelor's degree in engineering/science

Tools

TC bonder tools

Job description

Purpose of the Job:

• To lead the development, evaluation, and optimization of advanced ThermalCompression (TC) bonding and chip attach processes and equipment fornext-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures).
• To establish robust bonding recipes, ensure precise co-planarity and alignmentcontrol, and successfully drive TC bonder tools from R&D concept validationto customer/internal qualification.

Job:

• Advanced TC Bonding Process development for CoWoS PKG product family and CPO
• Tool & Hardware Development / Qualification
• Warpage & Co-planarity Control
• Failure Analysis & Reliability Enhancement
• Customer Development & Technology Transfer
• Lead assigned projects
• Yield Improvement & Yield Failure Analysis (FA)

Requirement:

• Bachelor’s degree or higher in engineering or science (e.g., Material Science,Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)
• R&D or mass production experience of at least three years in ThermalCompression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes
• Proven experience in driving customer development programs (e.g., JDP, customerqualification, technical evaluations) and managing customer requirements
• Fundamental understanding of advanced semiconductor packaging processes,thermal-mechanical bonding behavior, and warpage control
• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
• Ability to prepare technical documents and deliver presentations to internaland external stakeholders
• Proficiency in reading and writing technical documents

AllSuccessful candidates can expect a very competitive remuneration package and acomprehensive range of benefits.