Senior TCB & Advanced Packaging Applications Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 100,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding TCB) in Admiralty, Singapore. The role focuses on engaging semiconductor customers, understanding packaging roadmaps, and supporting advanced packaging applications.

The candidate will lead DOE activities, characterize processes, and collaborate with multiple engineering teams to drive bond quality and yield improvements.

Qualifications

• Minimum 5–15 years in semiconductor packaging.
• Hands-on experience in TCB, Flip Chip and Advanced Packaging.
• Experience with HBM/CoWoS/2.5D/3D packaging.
• Experience with fluxless or N2 bonding environment is advantageous.

Responsibilities

• Engage customers to understand packaging roadmap, requirements and targets.
• Support technical sales activities and customer discussions.
• Benchmark equipment and identify technology gaps.
• Translate customer requirements into equipment specs.
• Develop and optimize TCB process parameters on TCB equipment.

Skills

TCB knowledge

Bonding processes

Thermal management

Alignment systems

Vision systems

DOE

Statistical analysis

Education

Bachelor’s or Master’s Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering

Tools

OSAT/IDM/ semiconductor equipment environments

Job description

THE SUPREME HR ADVISORY PTE. LTD. is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding TCB) in Admiralty, Singapore. The role focuses on engaging semiconductor customers, understanding packaging roadmaps, and supporting advanced packaging applications.

The candidate will lead DOE activities, characterize processes, and collaborate with multiple engineering teams to drive bond quality and yield improvements.