R&D Engineer - Advanced Underfill & Packaging

PEOPLE PROFILERS PTE. LTD.

Singapore

On-site

SGD 61,000 - 73,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking an experienced engineer to design, qualify and optimize advanced underfill processes for high-density packaging, aligning with the technology roadmap and cost targets.

The role focuses on CoWoS PKG product family and CPO, including dispensing and material evaluation, void control, and reliability improvements, with leadership of assigned projects and active customer collaboration.

Qualifications

Bachelor’s degree or higher in engineering or science.
3+ years R&D or mass production experience in underfill/dispensing/encapsulation technology.
Proven experience driving customer development programs and managing customer requirements.
Fundamental understanding of advanced semiconductor packaging, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control.

Responsibilities

Design, qualify, and optimize advanced underfill processes to meet design rules and high-density packaging requirements.
Advanced Underfill Process development for CoWoS PKG product family and CPO.
Dispensing & Material Evaluation / Qualification
Void & Fillet Control
Failure Analysis & Reliability Enhancement
Customer Development & Technology Transfer
Lead assigned projects
Yield Improvement & Yield FA