Principal Wafer Bumping Architect & NPI Leader

United Test And Assembly Center Limited (UTAC); Singapore; Sur place; SGD 180 000 - 240 000; Plein temps

Résumé du poste

UTAC is seeking a Principal Engineer to lead development, qualification and introduction of advanced wafer bumping technologies. You will drive NPI, process development and technology transfer with customers, suppliers and cross-functional teams to deliver high-yield manufacturing solutions and next-generation packaging.

You will coordinate with internal teams to evaluate materials, processes and equipment, perform DOE and data analysis to ensure robust manufacturing processes, and report

Qualifications

• Bachelor’s degree in Electronics, Mechatronics, Engineering, Materials science or related field.
• 10+ years’ experience in Wafer Bumping Process Development.
• Strong technical expertise in wafer bumping processes and backend packaging technologies.
• Proven track record in developing, qualifying and transferring bumping technologies from R&D to manufacturing.
• Experience with DOE, statistical analysis, process characterization and yield improvement.

Responsabilités

• Lead NPI, package and process development in line with UTAC’s roadmap and schedules.
• Evaluate and qualify new materials, processes, equipment for bumping development.
• Perform DOE, process characterization and data analysis to establish robust processes.
• Coordinate technology transfer and process release to manufacturing.
• Conduct failure analysis and root cause investigation for development issues.
• Track milestones, risks and deliverables with stakeholders and management.
• Collaborate with Manufacturing, Quality, Reliability and Equipment teams to improve capabilities.
• Prepare technical reports and present qualification results to customers and management.
• Provide technical support for customer meetings and qualification activities.
• Drive continuous improvement to bumping process capability and efficiency.

Connaissances

NPI leadership

Cross-functional collaboration

DOE

Data analysis

Project management

Troubleshooting

Customer/supplier interaction

Formation

Bachelor’s degree in Electronics/Mechatronics/Engineering/Materials science

Outils

PVD

Photolithography

Electroplating

Ball Drop

Reflow

UBM formation

WLCSP

Fan-Out packaging

Panel Level Packaging (PLP)

2.5D/3D packaging

Cu Pillar bumping

JMP/Minitab/Python

Description du poste

UTAC is seeking a Principal Engineer to lead development, qualification and introduction of advanced wafer bumping technologies. You will drive NPI, process development and technology transfer with customers, suppliers and cross-functional teams to deliver high-yield manufacturing solutions and next-generation packaging.

You will coordinate with internal teams to evaluate materials, processes and equipment, perform DOE and data analysis to ensure robust manufacturing processes, and report