NPI Program Lead - Wafer and Bump Fab

stats chippac pte. ltd.

Singapore

On-site

SGD 140,000 - 200,000

Full time

6 days ago

Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

stats chippac pte. ltd. seeks a seasoned NPI program lead to drive new product introductions in a wafer fab environment. You will guide a multi-level team, align engineering and operations, and ensure smooth technology transfers from R&D to manufacturing.

The role emphasizes KPI tracking, timely NPI delivery, and risk-free ramp, with close collaboration with customers and internal teams to meet schedule and quality targets.

Qualifications

Requires engineering degree or higher in Electrical/Electronics/Mechanical/Chemical disciplines or Physics.
Minimum 5 years in Wafer Fab or Bump Fab.
Minimum 3 years in a management role.

Responsibilities

Lead NP I staff and engineers on new design reviews and feasibility builds.
Set up and track KPIs for qualification efforts.
Ensure timely delivery of all NPI lots and excursion-free ramp.
Train team on process characterization using statistical methods.
Coordinate technology transfers with R&D and operations.

Skills

Team leadership

Cross-functional liaison

Project management

Education

Engineering degree

Tools

Statistical methods

DOE (Design of Experiments)

Job description

The role emphasizes KPI tracking, timely NPI delivery, and risk-free ramp, with close collaboration with customers and internal teams to meet schedule and quality targets.

Get your free, confidential resume review.

or drag and drop your file here.