Senior Wafer Process Engineer: Yield, NPI & Transfer Lead

Broadcom; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Broadcom seeks an experienced process-development leader to drive advanced wafer fabrication modules and transfer to high-volume manufacturing. You will lead optimization efforts for thin film and thermal processes, mentor engineers, and collaborate with equipment, quality, and R&D teams to meet yield, quality, cost, and reliability targets.

The role requires 5+ years in semiconductor wafer fab processes, strong skills in SPC/DOE/FMEA, and proven problem-solving abilities.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
• At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
• Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
• Demonstrated leadership in cross-functional technical projects.
• Strong analytical, problem-solving, and communication skills.

Responsibilities

• Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement robust corrective/preventive actions.
• Define process control plans, SPC strategies, and OCAP execution.
• Collaborate cross-functionally with equipment, integration, quality, and R&D teams.
• Mentor junior engineers and technicians.
• Interface with suppliers on process and material improvements.

Skills

Leadership

Statistical analysis

DOE

FMEA

Cross-functional collaboration

Problem solving

Education

Bachelor’s or Master’s in Engineering

PhD in Engineering

Job description

Broadcom seeks an experienced process-development leader to drive advanced wafer fabrication modules and transfer to high-volume manufacturing. You will lead optimization efforts for thin film and thermal processes, mentor engineers, and collaborate with equipment, quality, and R&D teams to meet yield, quality, cost, and reliability targets.

The role requires 5+ years in semiconductor wafer fab processes, strong skills in SPC/DOE/FMEA, and proven problem-solving abilities.